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Fully automatic wafer thinning machine
Mainly used for automatic back grinding of 4'-8", 10-12" silicon wafers, double ...
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DOUBLE-SIDED LAPPING /POLISHING MACHINE
Suitable for double-sided grinding and polishing of silicon wafers, sapphire, qu...
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WAFER STRIPPING AND WASHING MACHINE
It is a device that combines wafer stripping and cleaning. The equipment can be ...
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CROPPING MACHINE FOR SILICON RODS
It is mainly used for single-line cutting of single crystal silicon rods in the ...
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CROPPING MACHINE FOR SILICON RODS
It is mainly used for multi-line truncation of single crystal silicon rod diamon...
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